Qualcomm SM8975 New Chip: Key Features and Differences

Architecture and Die Size

The upcoming flagship solution from Qualcomm, internally designated as SM8975 and expected to launch as the Snapdragon 8 Elite Gen 6 Pro, represents a significant architectural upgrade. According to reviewed documents, the SM8975 die measures approximately 12.6 × 10.67 mm, which is about 134 mm². This is larger than the Snapdragon 8 Elite Gen 5 (126.2 mm²), despite the Gen 6 Pro moving to a more advanced manufacturing process. The increased die area is due to the chip's greater complexity, which outweighs the density gains from the smaller process node. For comparison, the MediaTek Dimensity 9500 has a die size of around 140 mm².

Yield modeling for usable dies from a 300 mm wafer, assuming a defect density of 0.1 defects/cm² and an estimated wafer cost of $33,000 for the TSMC N2P process, results in a projected cost per die of about $84.62 (excluding packaging, testing, and IP licensing). These figures are approximate, as official pricing and defect rates for TSMC N2P have not been published.

Manufacturing Process

The SM8975 transitions to the TSMC N2P process—a refined 2nm-class node, making its debut in Qualcomm's flagship SoCs. This is a step up from the N3P process used in the Snapdragon 8 Elite Gen 5 and slightly ahead of the Apple A20 Pro, which uses the base N2 process.

Central Processing Unit (CPU)

The chip features an Oryon core configuration of 2+3+3: two high-performance cores, three performance cores, and three energy-efficient cores, continuing the evolution of the Qualcomm Oryon architecture. CPU clock speeds have not yet been specified in the documentation.

Graphics Processor (GPU)

The SM8975 is equipped with the Adreno 850 GPU, replacing the previous generation's Adreno 840. The graphics memory (GMEM) remains at 18 MB, the same as the previous generation. The GPU driver now offers a more detailed implementation of DCVS (Dynamic Clock and Voltage Scaling), providing more frequency steps, improved lag detection and feedback, and enhanced responsiveness when running multiple GPU contexts simultaneously.

The supported API set remains unchanged: OpenGL ES up to 3.2, OpenCL 3.0 FP, EGL 1.5, and Vulkan 1.4. This continuity simplifies driver migration for device manufacturers.

The standard SM8950 variant is expected to feature a scaled-down Adreno 845 and 12 MB GMEM, highlighting the differences between the standard and Pro versions.

Matrix ALU and AI Frame Fusion

This generation introduces two dedicated Matrix ALU blocks in the GPU shader processor, designed to accelerate GEMM and convolution operations fundamental to most on-device AI tasks. These enable the new AI Frame Fusion feature—Qualcomm's proprietary technology for AI-based frame upscaling and interpolation. Matrix ALU and AI Frame Fusion are exclusive to the Adreno 850 in the SM8975.

AI Frame Fusion operates in two modes: the super-resolution mode combines motion vectors, depth buffer, low-resolution color buffer, and the previous frame to upscale to 1080p or 1440p; the frame generation mode uses motion vectors and optical flow to interpolate a new frame between the current and previous frames, increasing perceived frame rates without a proportional rise in power consumption.

Cache and Memory

The SM8975 features a total of 16 MB L2 cache and 8 MB system cache, both larger than the current generation. The Pro version supports both LPDDR5X and the new LPDDR6 memory standard, while the standard SM8950 supports only LPDDR5X. This distinction is due to the higher cost of LPDDR6 amid a DRAM shortage.

Modem and RF

The Pro version comes with the new Qualcomm X105 modem, which has not been used in commercial Snapdragon chips before. Both the SM8975 and the standard SM8950 use the same RF front-end, which is not compatible with previous modems. The base version will likely also use the X105, possibly in a reduced configuration.

Wireless Interfaces

For wireless connectivity, two coprocessors are used: the WCN8841 and WCN8851 from the FastConnect 8800 series. Both support Wi-Fi 8 (2×2, 300 MHz MIMO), Bluetooth HDT at 2.4 GHz, and Thread. The WCN8841 supports Bluetooth 6.0, while the WCN8851 offers Bluetooth 7.0, a second Wi-Fi radio channel with 2×4/4×4 MIMO at 320 MHz, Bluetooth 7.0 at 5 and 6 GHz, and UWB.

The modem's RF section includes two transceivers: the SDR765 (sub-6 GHz only, built on TSMC N6RF) and the SDR885 (Qualcomm's first sub-6 GHz transceiver with 4×4 MIMO for simultaneous transmit and receive, supporting 256-QAM for transmission and 1024-QAM for reception, and operating in both sub-6 GHz and mmWave according to 3GPP Release 18).

Positioning, Cost, and Expected Devices

With this generation, Qualcomm's pricing strategy further segments the flagship market. The SM8975 is expected to be noticeably more expensive to produce than the standard SM8950, a gap likely to widen due to the cost of LPDDR6. The Pro version may be reserved exclusively for ultra-premium devices.

Launch Timeline

The SM8975 is expected to be announced at the Snapdragon Summit, which will take place in Maui, Hawaii, from September 22 to 24, 2026. According to preliminary information, the first device powered by the Snapdragon 8 Elite Gen 6 may be the Xiaomi 18 series in China, unveiled simultaneously with Qualcomm's presentation. Other manufacturers are expected to release their devices later in 2026 and into early 2027.